Adsorption TiO2 Aryl-diazonium salts Transmission electron microscopy Residual stress Structure Mott insulator Sputtering Bixbyite Copper Band alignment Ambipolar material A Multilayers V2O3 CHLORINE PLASMAS Capacitance Spectroscopic ellipsometry Amyloid precursor Nanotubes Calcined clay B Chemical synthesis BOMBARDMENT Oxides CIGSe Resistive switching X-ray photoelectron spectroscopy Vanadium Sesquioxide CaTiO3Pr^3^+ Applications industrielles Mott insulators B2 Semiconducting indium compounds Biofilms microbiens AZO thin films Anatase Kirkendall effect Biomasse C Photoelectron spectroscopy Biocapteurs Functionalization A Thin films Ablation laser Thin film Carbon nitride Carbon NEXAFS Avalanche breakdown AuCu alloy Plasmas froids Nanocomposite Thin films Cathepsin Scanning electron microscopy Alloying XPS X-ray diffraction 3 nm in size Aluminium nitride Carbon Nanotube Plasma etching A Chalcogenides Chemical detection PECVD A-CNx TEM Chalcogenides Atomic force microscopy Band gap B3 Solar cells Titanium dioxide Alzheimer's disease Etching A3 Physical vapor deposition processes A1 Characterization Colloidal solution Selenization SF 6 Chemical and biological sensors Chalcogenide glass Low-pressure plasma processing Physical vapor deposition Atomic layer etching Transfert d'énergie Optical properties CNTs’ collapse B2 Semiconducting alloys Buffer Couple B2 Quaternary Bipolar resistive switching BRS CH4 Non-volatile memory Films Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Magnetron sputtering Sol-gel Chalcogenide AlN Semiconductors B1 Inorganic compounds Amorphous Carbon nanotubes